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Cisco Cisco Advanced Collaboration Architecture(R)

custom computing device specialists Renews Cisco superior Collaboration… | killexams.com real Questions and Pass4sure dumps

customized laptop specialists Renews Cisco superior Collaboration architecture Specialization

HAUPPAUGE, N.Y. (PRWEB) July 18, 2018

customized laptop experts (“custom”), a leading expertise options company, announced nowadays it has renewed its Cisco superior Collaboration architecture Specialization. This specialization acknowledges customized as having again fulfilled the practicing requirements and application necessities to promote, set up and assist extremely subtle applications-primarily based Cisco Collaboration solutions.

"it's an veneration to net hold of this commodious difference," observed Kyriakos Kaimis, vice chairman of expertise at custom. "customized is steadfastly invested in the americans, techniques, and expertise that wait on clients power enterprise productiveness. This specialization permits custom to deliver robust, collaboration options to their customers.”

As a Cisco advanced Collaboration Specialization companion, customized has established its skill to provide sophisticated, cost-brought Cisco solutions via in-depth revenue capabilities, know-how talents and repair offerings. Cisco superior Specialization companions labor with modern and present technologies to align add-ons of those architectures with their customers’ strategic dreams, helping transform company strategies, enhance organizational efficiency and hurry up the time to market.

The Cisco Channel companion program gives companions with the working towards required to construct income, technical and Cisco Lifecycle functions talents, after which validates their talents through a 3rd-birthday celebration audit. Cisco Channel accomplice certifications—choose, Premier, and Gold—symbolize an increasing breadth of abilities throughout key technologies and a partner’s capacity to bring built-in networking solutions. Cisco Channel associate specializations—SMB, express, advanced and master—reflect an expanding depth of income, technical and service abilities in selected applied sciences. Cisco advanced Specializations provide custom entry to complete sales, technical, and lifecycle features practising and lead purchasable from Cisco.

About custom desktop SpecialistsFounded in 1979, customized desktop consultants helps Northeast public and private sector valued clientele net maximum price from their IT investments. custom’s pleasing aggregate of privately owned flexibility and wide IT potential empowers it to architect customer-centric solutions that bring effects. http://www.customtech.com

Cisco, the Cisco brand and Cisco methods are registered trademarks of Cisco systems Inc. in the united states and inevitable other international locations.

###

Contact author

MaryAnn Benzola custom laptop experts, INC.+1 (631) 761-1465Email > visit site


LaSalle options once again Achieves advanced Collaboration structure Specialization From Cisco in the united states | killexams.com real Questions and Pass4sure dumps

ROSEMONT, IL--(Marketwired - March 03, 2015) - To aid the increasing duty of collaboration options that leverage the intelligence of the network, LaSalle options announced nowadays that it has executed the superior Collaboration architecture Specialization from Cisco. This specialization recognizes LaSalle options as having fulfilled the practicing requirements to promote, design and installation comprehensive Cisco® Collaboration architecture solutions.

As a Cisco superior Collaboration architecture really kindly partner, LaSalle options has invested in the practising required to bring differentiated enterprise price throughout the integrated, open groundwork of the collaboration structure. Cisco advanced Collaboration structure specialized companions labor with modern and current applied sciences to align add-ons of this structure with their valued clientele' strategic dreams, assisting seriously change enterprise procedures, extend organizational effectivity and accelerate the time to market.

"we're arrogant to once again achieve the Cisco superior Collaboration architecture Specialization," says Steven Robb, President of the solutions group at LaSalle solutions. "This carrying on with training and partnership is a mutual ongoing dedication, as Cisco requires annual renewal for this and many other specializations. we're arrogant to proceed their dedication, and suppose this recognition reflects their dedication to featuring the team, strategies and tools to convey the sophisticated options their purchasers absorb near to import on, and permit us to exceed expectations to fulfill brand modern enterprise challenges and construct their aggressive edge."

The Cisco Resale Channel software provides partners with the practicing required to construct sales, design and technical skill after which validates their skills via a 3rd-celebration audit.

This recertification builds on a few Cisco-related milestones LaSalle options has in the past accomplished, together with:

  • Cisco US features partner of the 12 months: present
  • client satisfaction Excellence Gold famed person: current, forty Consecutive Quarters. 
  • Cisco® Gold certified associate
  • Cisco master Unified Communications Specialization
  • Cisco grasp safety Specialization
  • international companion network accomplice
  • superior statistics middle architecture Specialization
  • superior borderless network structure Specialization 
  • ATP - Cisco TelePresence Video superior
  • ATP - statistics Virtualization Reseller
  • ATP - power management Suite Integrator
  • ATP - identification functions Engine
  • Cisco functions partner of the year, censorious place: 2010 - 2013
  • About LaSalle options

    situated in 1980, LaSalle solutions is a number one provider of lifestyles-cycle administration features for technology and capital property. These services involve acquisition and financing, IT asset management, protection compress administration, remarketing and disposition. LaSalle options' processes, fabulous client service and strong, market-main cloud-primarily based toolset, LAMP, enable consumers to greater economically and comfortably manipulate and contrivance to fullfil their desires.

    LaSalle solutions is an independently operated enterprise and a subsidiary of MB economic fiscal institution, a publicly traded Chicago-based mostly bank maintaining business. MB fiscal is traded on the NASDAQ as "MBFI".

    For extra tips on LaSalle solutions, gratify consult with www.elasalle.com and www.YouTube.com/LaSalleSolutions.

    LaSalle solutions and LAMP are registered emblems of LaSalle options in the u.s.. Cisco and the Cisco brand are trademarks or registered emblems of Cisco and/or its affiliates within the U.S. and other nations.


    LaSalle solutions Renews Cisco advanced Collaboration architecture Specialization | killexams.com real Questions and Pass4sure dumps

    March 06, 2018 15:00 ET | supply: LaSalle solutions

    ROSEMONT, unwell., March 06, 2018 (GLOBE NEWSWIRE) -- LaSalle solutions, a number one issuer of expertise lifecycle administration services, announced nowadays that it has renewed its Cisco superior Collaboration architecture Specialization. The specialization acknowledges that LaSalle has again fulfilled the practising necessities and application must haves to sell, design and set up complete Cisco Collaboration options.

    As a Cisco advanced Collaboration Specialization associate, LaSalle solutions has demonstrated its capability to supply sophisticated, value-added Cisco solutions via in-depth earnings capabilities, expertise handicap and service offerings. Cisco advanced Specialization companions labor with modern and existing applied sciences to align accessories of these architectures with their valued clientele’ strategic dreams, helping seriously change enterprise procedures, boost organizational efficiency and hurry up the time to market.

    “we are arrogant to once again obtain superior Collaboration structure Specialization from Cisco,” referred to Steven Robb, president of the solutions community at LaSalle solutions. “Our valued clientele look to us for assist improving collaboration across their businesses. This specialization is because of the the difficult labor LaSalle solutions places in every yr to live certain that they now absorb the premier technologies and potential to extend customer collaboration options to extra sustainable, unified solutions.”

    About LaSalle solutions

    centered in 1980, LaSalle solutions is a leading provider of expertise lifecycle asset management functions. LaSalle allows its shoppers to better their expertise operations via better approaches, administration and reporting for improved planning and recur on investment. LaSalle options’ tactics, outstanding client service and robust, market-leading cloud-based toolset, LAMP, allow valued clientele to attain more desirable enterprise outcomes via transparency and respectable results at their fingertips.

    LaSalle options is a division of MB gadget Finance LLC, a subsidiary of MB economic fiscal institution, N.A., a commerce bank headquartered in Chicago. MB fiscal Inc. is the publicly traded keeping commerce for MB fiscal bank, N.A. and is traded on the NASDAQ as “MBFI.”

    For extra suggestions on LaSalle options, gratify hunt counsel from www.elasalle.com and www.YouTube.com/LaSalleSolutions.

    LaSalle options and LAMP are registered emblems of LaSalle options within the united states.

    Press Contact Beth Kirshenberg LaSalle options 847.823.9600

    Rosemont, Illinois, u.s.

    Press Contact Beth Kirshenberg LaSalle options 847.823.9600 LaSalle Solutions Logojpg_1200pxw.jpg

    codecs obtainable:


    700-038 Advanced Collaboration Architecture(R) territory Engineer

    Study lead Prepared by Killexams.com Cisco Dumps Experts


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    700-038 exam Dumps Source : Advanced Collaboration Architecture(R) territory Engineer

    Test Code : 700-038
    Test designation : Advanced Collaboration Architecture(R) territory Engineer
    Vendor designation : Cisco
    brain dumps : 50 real Questions

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    ZF is using the Xilinx® Zynq® UltraScale+™ MPSoC platform to wield real-time data aggregation, pre-processing, and distribution, as well as to provide compute acceleration for the AI processing in ZF's modern AI-based electronic control unit. ZF selected this adaptable, bright platform because it provides the processing power scalability and flexibility essential for the ZF ProAI platform to live customized for each of its customer's unique requirements. 

    "The unique selling proposition of the ZF ProAI is its modular hardware concept and open software architecture. Their direct is to provide the widest viable compass of functions in the territory of autonomous driving," explained Torsten Gollewski, head of ZF Advanced Engineering and generic manager of Zukunft Ventures GmbH. This approach is unique compared to other systems on the market, which utilize a fixed combination of hardware and software architecture – a solution that can potentially restrict functionality and add more cost.

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    Xilinx has been selling chips to automakers and Tier 1 automotive suppliers for over 12 years. More than 160 million Xilinx devices are in automotive systems today, and approximately 55 million of these are used for ADAS alone.

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    Many capabilities highlighted used to live available only as third-party software, but now are considered standard in many packages and are helping change automation implementations.

    HMI animations

    Dynamic HMI content makes it easier to visualize intricate manufacturing processes. One approach uses a widget to allow users to animate XML-based scalable vector graphics (SVG) images they already absorb or to metamorphose them from 2-D CAD with runtime data.

    The user drags and drops a widget onto the desired page in the HMI application and configures it there. At runtime, the image’s animation can live controlled from the application program. Rotations, transitions, and movements can live animated from one SVG image, which saves the time and cost needed to create sequences of multiple images. Also, since SVG images are based on vector graphics, they retain their tall resolution without loss of quality even when zoomed in.

    Figure 1: Dynamic human-machine interface (HMI) content such as scalable vector graphics (SVG) makes it easier to visualize  intricate manufacturing processes. Courtesy: B&R Automation

    Figure 1: Dynamic human-machine interface (HMI) content such as scalable vector graphics (SVG) makes it easier to visualize intricate manufacturing processes. Courtesy: B&R Automation

    Managing machine variants

    Modular applications can live implemented to add I/O modules to existing programs at any time without touching the machine code. This can befall before a machine is delivered or even at runtime, which simplifies managing machinery and apparatus variants. I/O variant configurations can live generated from enterprise resource planning (ERP) or an order management system. No engineering tools are required even if third-party drives or modules are added.

    Additional variants and options may live configured directly on the machine using the confiscate configuration tools. Some progress environments involve a tool that allows the programming of options in ladder logic without affecting the machine’s primary application. The machine can live commissioned without having to modify the original machine software, giving the quit user needed flexibility while preserving the integrity of the original apparatus manufacturer (OEM) solution.

    Figure 2: Input/output (I/O) machine variant configurations can  live generated directly from an enterprise resource planning (ERP) or order management system and no engineering tools are required. Courtesy: B&R Automation

    Figure 2: Input/output (I/O) machine variant configurations can live generated directly from an enterprise resource planning (ERP) or order management system and no engineering tools are required. Courtesy: B&R Automation

    Integrated vision

    Another trend is integrating vision cameras into the machine control program, including bright cameras, lighting, and advanced image processing algorithms. This allows microsecond synchronization between the machine vision and other automation components with one engineering tool and one application to manage.

    PDF reports

    Communication platforms can live built into the control system, and they automatically can generate PDF reports. Reporting functionalities collect statistical machine data and information from any software components provided by the control platform. The data, layout, and design of the reports can live customized and the user can define the language and units used.

    Report design options compose it viable to customize reports to the users’ needs. Graphical elements such as images and tables can live included in the reports. To protect against unauthorized access, it is viable to encrypt the files. The reports can live sent automatically via e-mail at a defined time or triggered by a specific event. In addition, reports can live saved to external storage media such as a USB flash drive or sent directly from the machine to network printers.

    Figure 3: Communication platforms can  live built into the control system, and they can automatically generate PDF reports. There are options available to customize reports to the specific needs of different users. Courtesy: B&R Automation

    Figure 3: Communication platforms can live built into the control system, and they can automatically generate PDF reports. There are options available to customize reports to the specific needs of different users. Courtesy: B&R Automation

    Data management

    Implementing databases in applications is easier with a database integration toolbox. Data may live archived from the territory flat to a database, regardless of whether that database is located on-site or in the cloud. This simplifies managing big volumes of data, which is key to Industrial Internet of Things (IIoT) data acquisition and analytics requirements.

    Manufacturing machinery can generate huge volumes of data, which must live visualized, archived, or passed on to higher-level systems for processing to live useful. Giving the control system a database interface makes it viable to send data directly from the controller to the database. Common database functions such as stored procedures allow key performance indicators (KPIs) to live generated as needed, resulting in more optimized manufacturing processes.

    Figure 4: With a database integration toolbox, it is  viable to archive data directly from the  territory  flat to a database, which helps simplify managing  big volumes of data. Courtesy: B&R Automation

    Figure 4: With a database integration toolbox, it is viable to archive data directly from the territory flat to a database, which helps simplify managing big volumes of data. Courtesy: B&R Automation

    Machine simulation and digital twins

    Automation programming is no longer limited to isolated machine programs. It now includes integrated production systems such as the next generation of bright track technologies that define the adaptive machine.

    Consider the automation software challenge of independently controlling individual products traveling on shuttles in coordination with dozens or even hundreds of other shuttles on a track system. Each workstation represents a machine module, and entire the machine control and ancillary functions apply for each product, production module, and the overall system.

    Built-in simulation software is a valuable tool to visualize and optimize bright track system requirements. It facilitates engineering and reduces time to market for modern track systems and for running modern products on existing systems. Integrated simulation software is based on process-oriented programming.

    These simulation tools wait on ensure shuttles finish not collide, cross virtual barriers, or violate configurable hurry limits. FDA-compliant tracking besides can live implemented. The software can link the product data with the respective shuttles and compose the manufacturing process traceable.

    When track system applications are created using process-oriented programming, a software engineer simply defines rules for how the shuttles should behave on the track. The rules become lively when shuttles pass virtual trigger points. This makes motion sequence implementation more efficient and reduces the amount of programming required for the individual shuttles.

    With integrated simulation options, a track system developer can shun tests to identify the optimum number and hurry to maximize shuttle productivity. The same system software is used in the simulation and the real plant, which makes it viable to switch between simulation and real operation at any time. How the shuttles interact with mechanical elements, such as robots, besides can live visualized.

    Figure 5: Automation programming now includes integrated production systems such as the next generation of  bright track technologies that define the adaptive machine. Courtesy: B&R Automation

    Figure 5: Automation programming now includes integrated production systems such as the next generation of bright track technologies that define the adaptive machine. Courtesy: B&R Automation

    Selecting the prerogative integrated automation platform

    These examples available to the machine automation programmer demonstrate how far beyond stand-alone machine operation today’s software considerations—and tools—extend. It’s no longer a question of choosing ladder logic versus C programming. It’s about selecting an integrated automation platform that delivers a configurable software suite to manage—not just control—machines.

    For an architect to develop these functions on a one-off machine project basis would live daunting at best, and impractical in reality. At the same time, these kinds of modern software functions are essential to realize the connected machine, let solitary manufacturing IIoT, and are designed to deliver machinery to back the modern digital commerce models.

    John Kowal is director, commerce development, B&R Industrial Automation Corp. Edited by Chris Vavra, production editor, Control Engineering, CFE Media, cvavra@cfemedia.com.

    MORE ANSWERS

    Keywords: Automation software, human-machine interface, automation programming

    Automation hardware and software today are no longer stand-alone functions; they encompass almost every aspect of the manufacturing floor.

    Advances involve integrated vision, automated data reports, managing machine variants, and improved simulation.

    Automation software advances are essential to delivering the modern digital commerce models for today’s interconnected manufacturing environment.

    Consider this

    What other advances in automation programming could provide major benefits to manufacturers?


    What’s the prerogative Path For Scaling? | killexams.com real questions and Pass4sure dumps

    The growing challenges of traditional chip scaling at advanced nodes are prompting the industry to select a harder scrutinize at different options for future devices.

    Scaling is soundless on the list, with the industry laying plans for 5nm and beyond. But less conventional approaches are becoming more viable and gaining traction, as well, including advanced packaging and in-memory computing. Some options are already here, while others are soundless in R&D and require more funding to net off the ground. Some may never work.

    Nevertheless, the industry is looking for solutions, whether that involves IC scaling or novel approaches.

    Chip scaling is being pursued by several chipmakers and foundry customers. For this, chipmakers are ramping up 10nm/7nm, with 5nm and 3nm in R&D. But at each node, the costs are escalating, meaning that only a select few with profound pockets can afford to migrate to the next step. Plus, the benefits of scaling are shrinking at each node, and the traditional approach is no longer suitable for entire devices.

    Even Intel, which created Moore’s Law, is coming to grips with the issues and is re-thinking the pass chips are developed amid the shift towards 5G, artificial intelligence and machine learning.

    “In the previous generations, the avow has been that transistor density and Moore’s Law will play the lead role to solve computing problems,” said Raja Koduri, senior vice president of Core and Visual Computing at Intel. “But as the process node transitions absorb slowed from the pace of the previous decades, it is the essence of Moore’s Law that continues to provide modern technologies and capabilities to meet the demands of modern computing. The message of Moore’s Law is about more than transistors alone, with the combination of transistors, architectural research, connectivity advancements, faster reminiscence systems, and software working together to drive it forward.”

    This is not to counsel Intel or others absorb stopped scaling. But in addition to monolithic device scaling, the industry is looking at modern ways to travel the ball forward. For example, a growing list of entities are throwing their weight behind the chiplets model. Intel and TSMC are the latest backers of chiplets.

    “What we’ve done over the eventual 15 to 20 years is to let the leading edge—the fast-path computing section of whatever product you’re designing—push the technology, and everything else they want to integrate on that chip comes along with it,” said David Fried, CTO at Coventor, a Lam Research Company. “You can finish you I/O circuits, your low-speed data path, memory, power conservation. Okay, it’s going to live in the advanced technology, but that’s not really why they did the advanced technology in the first place. We’re soundless doing something similar. A lot of these high-end applications are soundless driving the front-end of technology, but instead of just dragging along reminiscence we’re going to heterogeneous integration. Instead of just dragging along the I/O or the analog part, we’re going to some 3D stacking to region those together. So everything is customized, but only because we’ve benign of stopped just dragging them along into the most advanced technology.”

    In this changed environment, chipmakers and foundry customers must preserve a nigh eye on the various manufacturing and related options to enable future devices. Some may utilize more than one option as there is no one technology that fits entire applications. And, of course, not entire will migrate to advanced nodes.

    Among the leading options:

  • Gate-all-around. A modern transistor character targeted for 3nm in 2020.
  • Monolithic 3D. A method of stacking transistors on each other.
  • Near- and in-memory computing. Near-memory incorporates reminiscence in a package. In-memory has various meanings, but in some circles, the thought is to effect the computational tasks within a memory.
  • Advanced packaging. The thought is to integrate dies in a package. Chiplets drop into this category. With chiplets, you absorb a menu of modular chips, or chiplets, in a library. Then, you assemble chiplets in a package and connect them using a die-to-die interconnect scheme.
  • Going to gate-all-aroundFor more than half a century, the growth engine has revolved around Moore’s Law, the axiom that states transistor density would double every 18 to 24 months. Adhering to Moore’s Law, chipmakers introduced a modern process in that time interval to lower the cost per transistor.

    At each node, chipmakers scaled the transistor specs by 0.7X, enabling the industry to deliver a 40% performance boost for the same amount of power and a 50% reduction in area. That formula worked until 20nm, when traditional planar transistors ran out of steam due to technical issues. In response, Intel moved to finFETs at 22nm, followed by the foundries at 16nm/14nm. In finFETs, the control of the current is accomplished by implementing a gate on each of the three sides of a fin.

    Before 14nm, there was a 30% improvement in price/performance at each node, according to analysts. From 14nm to 10nm, there is more than 20% improvement, and at less than 10nm there is more than 20%. At 3nm, there is about 20% improvement, analysts said.

    However, the industry was forced to travel from planar to finFETs at 20nm. The industry faced short channel effects and other issues at 20nm. In other words, finFETs solved those problems, but it’s debatable if you net the traditional scaling improvements at each node.

    FinFETs finish provide more performance with lower power, but it becomes more difficult to scale them at each node. As a result, the cadence for a fully scaled node has extended from 18 months to 2.5 years or longer. In addition, fewer foundry customers can afford to travel to advanced nodes. IC design costs absorb jumped from $51.3 million for a 28nm planar device to $297.8 million for a 7nm chip and $542.2 million for 5nm, according to IBS.

    “PPAC (power, performance, area, cost) scaling at the leading edge is getting more intricate and costly,” said Yang Pan, corporate vice president of advanced technology progress at Lam Research. “As process complexity increases, managing process-to-process interaction through advanced process control is a must to reduce variation.”

    Over time, the market split into two camps. One involves IC suppliers that don’t require finFETs or can’t afford them. This includes analog, mixed-signal and RF, which utilize mature processes. That market is thriving.

    For example, several foundries proffer finFET processes. Yet, require is robust for mature processes at 40nm and above. “UMC is experiencing tall require from mature 12-inch processes,” said Jason Wang, co-president of UMC. “With modern applications in 5G, IoT, automotive and AI requiring these technologies, they anticipate the market conditions driving this require to remain strong for the foreseeable future.”

    Even 200mm fab capacity and chips are soundless in tall demand. “For the 8-inch, they absorb to remain optimistic and cautious about the 8-inch outlook. They absorb pretty kindly assurance that they will remain fully loaded in Q4 2018,” Wang said in a recent conference call.

    The second camp involves companies that continue to scale and require high-performance chips. “Moore’s Law is definitely slowing down, but I’m confident there will live continued innovation everywhere to preserve it going for a while,” said Aki Fujimura, chief executive of D2S. “Regardless, there’s no question there is a requisite for more compute power. There was some talk of how they can no longer utilize more compute power perhaps 10 years ago. There’s no more talk about that now.”

    For years, IC scaling has been the main pass to boost transistor density and enable high-performance chips. Today, 7nm is the most advanced process. By most accounts, 7nm is expected to live a long-running node, as it provides enough PPAC for most apps.

    Still, TSMC plans to extend the finFET to 5nm, which is slated for 2020. But finFETs will likely shun out of steam at 5nm, meaning the industry will require a modern transistor character at or around 3nm.

    Moving to a modern transistor character isn’t simple. It requires modern tools, materials and integration schemes. Plus, the IC design costs will live astronomical at 3nm, so the commodious question is whether anybody will migrate to this node.

    “Initially, there will live the accustomed suspects working with 3nm, such as Nvidia, Xilinx, Apple and Samsung,” said Joanne Itow, an analyst with Semico Research. “Once they net entire the kinks worked out, you’ll observe Qualcomm, MediaTek, AMD, Intel (Altera) and others jumping on board.”

    The industry has been working on next-generation transistors in R&D, and for 3nm it has narrowed the territory to two technologies, nanosheet and nanowire FETs. Both are classified as gate-all-around technologies. They implement a gate on four sides of the structure, enabling more control of the current.

    The nanosheet FET is the current favorite. It has a wider channel than the nanowire, enabling more drive current. Plus, the nanosheet is an evolutionary step from a finFET, meaning it uses many of the same process steps. In a nanosheet, a finFET is placed on its side and is then divided into part horizontal pieces, which compose up the channels. A gate wraps around each channel.

    Fig. 1: Cross-section simulation of (a) finFET, (b) nanowire, and (c) nanosheet. Source: IBM

    In 2017, Samsung introduced what it calls a Multi Bridge Channel FET (MBCFET), which is a nanosheet FET. Targeted for 3nm, Samsung’s MBCFET is slated for production in 2020. Intel and TSMC haven’t announced their plans beyond finFETs.

    At the recent IEDM conference, Samsung presented its first results with MBCFET, maxim it has developed a functional SRAM device. “Three representative superior characteristics of MBCFET compared to finFET absorb been demonstrated — better gate control with a 65mV/decade sub-threshold sway at a short gate length; higher DC performance with a larger effective channel width at a reference footprint; and design flexibility with variable nanosheet widths,” said Geumjong Bae, a researcher at Samsung.

    A nanosheet FET enables the industry to vary the width of the channels or sheets in devices. For example, a nanosheet FET with a wider sheet provides more drive current and performance. A narrow nanosheet has less drive current, but it takes up less area.

    All told, nanosheet FETs enable the industry to scale a device when finFETs hit the wall. But nanosheets provide only marginal gate-pitch scaling benefits. Design costs are the other commodious issue.

    What is monolithic 3D?The industry has been working on alternatives, as well, including monolithic 3D—sometimes called 3D sequential integration.

    In simple terms, you develop a layer of transistors on one substrate. The transistor character depends on the application, but you could utilize analog, logic or memory. Then, you develop another layer of transistors on another substrate. The two layers are bonded and connected using tiny interconnects, and the quit result is a 3D monolithic device. The technology has demonstrated up to a 50% belt reduction in devices, according to Imec.

    DARPA, Imec, Leti and others are pursuing the technology in R&D, although it’s unclear when it will issue in the market because there are several challenges to solve. For instance, the top layer requires various process steps with temperatures around 500°C. Otherwise, the top layer can abase the bottom tier. So the industry requires tools that labor at lower temperatures, which has been the primary roadblock.

    There are reports of progress. For example, using a 3D sequential process with temperatures at 520°C, Imec stacked two layers of finFETs on top of each other. The finFETs absorb a 45nm pitch and 110nm gate pitch.

    Fig. 2: Stacking finFETs on finFETs Source: Imec

    In sequential processing, you absorb a substrate, based on either bulk CMOS or silicon-on-insulator (SOI) technology. Then, you build two tiers (bottom and top) on the substrate. In the flow, you first build the bottom tier with a layer of transistors.

    “You build your first layer of the device. They did it with bulk finFET, but it could live any technology,” said Anne Vandooren, principal member of the technical staff at Imec.

    Then, a flat of interconnects are processed on that layer. The next step is to fabricate the top with a layer of transistors. The bottom and top layers are bonded.

    This isn’t limited to finFETs. “It really depends on the application. It can live a CMOS logic cell on a CMOS logic cell. Or it could live another application fancy RF on logic, sensor on logic, reminiscence on logic, or logic on memory,” Vandooren said.

    Leti, meanwhile, has been working on a similar technology, and has recently developed some modern capabilities. First, Leti has demonstrated a low-resistance polysilicon gate for the top transistors. The layer was processed using a nanosecond laser anneal tool, which works at higher temperatures without impacting the bottom level. The R&D organization besides has developed an epi process at 500°C. It has developed other processes, as well.

    “This integration scheme offers a wide spectrum of applications, including for example: 1) increasing integration density beyond device scaling; 2) enabling neuromorphic integration where RRAM is placed between top and bottom tiers; and 3) enabling low-cost heterogeneous integration for smart sensing arrays,” said Maud Vinet, advanced CMOS laboratory manager at Leti.

    Processing in memoryThere are other approaches, as well, namely using a memory-centric technology. Today’s reminiscence hierarchy is straightforward. SRAM is integrated into the processor for cache. DRAM is used for main memory. And disk drives and NAND-based solid-state storage drives (SSDs) are used for storage.

    In systems, data moves between the reminiscence and a processor. But at times this exchange causes latency and power consumption, which is sometimes referred to as the reminiscence wall.

    DRAM is one of the culprits. The data rates for DRAM absorb fallen behind in terms of bandwidth.

    The industry has been working to resolve this problem for years. The latest solutions involve two technologies—near-memory computing and in-memory computing. “The growing trend of near-memory computing and in-memory computing will drive modern architectures that are integrating logic (digital and analog) and modern memories,” Lam’s Pan said.

    Near-memory computing isn’t new. It involves integrating high-bandwidth reminiscence (HBM) in a package, enabling faster data access and lower power consumption. For example, in a 2.5D package, a vendor could incorporate a graphics processor and HBM, which stacks DRAM dies on top of each other to enable more I/Os.

    In-memory computing, sometimes called processing in-memory, besides is emerging. This concept means different things to different people. In some circles, in-memory computing involves a process in which the computations are performed within the reminiscence and/or at the location of the data storage.

    The thought has been around for years, but the early efforts fell short. Today, chipmakers, startups, R&D organizations and universities are working on the technology and making progress.

    “There are products coming out in that direction. In-memory computing is happening now using existing reminiscence technology. The products are being built specifically for those applications. That will drive more segmentation in reminiscence applications,” said Gill Lee, managing director of reminiscence technology at Applied Materials.

    For example, startup Mythic recently introduced a matrix multiply reminiscence architecture. It performs the computations inside the reminiscence cells using analog currents and flash memory.

    “Mythic does this in a 40nm process. Effectively, Mythic has turned back the clock on process scaling,” said Dave Fick, CTO of Mythic, in a blog. “While other system designers are struggling to net from 7nm to 5nm, Mythic will live scaling to 28nm.”

    Mythic and others are using the technology to drive neural networks. In neural networks, a system crunches data and identifies patterns. It matches inevitable patterns and learns which of those attributes are important.

    A neural network consists of an input layer, a hidden layer, and an output layer. Data is fed into the input layer and then processed in the hidden layer with a set of coefficients. This either amplifies or dampens the input using a weighted system, “thereby assigning significance to inputs for the job the algorithm is trying to learn,” according to AI startup Skymind.

    The problem is that the data exchange is sometimes gradual and consumes power. “To overcome this challenge, in-memory computing, where computing is done at the location of the data storage, has been proposed to accelerate the computation,” said Xiaoyu Sun, a Ph.D. student from Arizona situation University and lead author in a paper at IEDM. The paper was co-authored by the University of Notre Dame and the Georgia Institute of Technology. (Sun has transferred to Georgia Tech.)

    There are some limitations using existing memories, however. “The in-situ training accuracy suffers from unacceptable degradation due to undesired weight-update asymmetry/nonlinearity and limited bit precision,” Sun said.

    Instead of using existing memory, ASU, Notre Dame and Georgia Tech are exploring the utilize of a 2T-1C ferroelectric FET (FeFET) reminiscence technology. “We propose a novel hybrid approach where they utilize a modulated ‘volatile’ gate voltage of a FeFET to delineate the least significant bits for symmetric/linear update during training only, and the utilize of nonvolatile polarization states of the FeFET to hold the information of most significant bits for inference,” Sun said.

    Others are besides working on the technology. For example, Leti is developing in-memory computing using RRAM, while Samsung is utilizing MRAM. It’s too soon to Tell which technology will prevail.

    “You will net different answers about the definition of in-memory computing, depending on who you ask,” Applied’s Lee said. “Although memory-centric computing is soundless in the early stages, what is evident is how the traditional borders of reminiscence tasks are becoming blurred.”

    Another in-memory computing technology character is called neuromorphic computing. In simple terms, neuromorphic computing enables massively parallel analog computing for profound learning apps. “Neuromorphic reminiscence is more long term. The candidates are more fancy ReRAM and modern memories, especially filament-type ReRAM. Other types of memories, including phase-change memory, can live used in neuromorphic computing,” Lee said.

    Chiplets maniaAdvanced packaging has been making gains in the market as an alternative to chip scaling. Different approaches absorb been used in limited shape for decades in niche applications. Cost has been one of the main challenges here, but that could change as the industry marches toward heterogeneous integration, which involves putting multiple chips in an IC package.

    “An evolution in packaging technology is being driven by a slowdown of Moore’s law,” said Pieter Vandewalle, generic manager of the ICOS division at KLA-Tencor. “This is driving IC designers to labor on both chip and package design to optimize the electrical and thermal behavior, and ultimately define the performance of the total package.”

    There are several ways to implement multi-die packages, such as 2.5D/3D and fan-out. In one example, Amkor and GlobalFoundries recently presented a paper on a 22nm FD-SOI device, which is housed in an advanced wafer-level package. The companies devised a test vehicle, and the goal was to study the chip-board interaction of the package.

    “Recently, wafer-level packaging has been in tall demand, especially in mobile device applications as a path to enable miniaturization while maintaining kindly electrical performance,” said Jae Kyu Cho, a packaging engineer at GlobalFoundries, during a recent event. “The 22nm FD-SOI technology platform is an advanced silicon node for energy-efficient applications that deliver finFET-like performance. Combining both technologies will compose it more attractive for various markets, such as 5G mmWave, IoT, wearables and automotive.”

    The latest craze is chiplets. In chiplets, the thought of putting together different modules fancy LEGOs has been talked about for years, but few absorb implemented it.

    Fig. 3: Chiplets connected with interposer. Source: Georgia Tech

    Now, momentum is structure for chiplets for various apps. For example, there is a surge for compute-intensive specialized applications, such as machine learning. This is driving the requisite for domain-specific architectures fancy hardware accelerators.

    Needless to say, these devices must live economically feasible to design and fabricate. That’s where chiplets proper in. “To meet current and future growth demands, providers requisite a more efficient approach to fullfil the needs of a wide compass of data hub applications,” said Kevin O’Buckley, generic manager at Avera Semiconductor, the ASIC spin-off from GlobalFoundries.

    Chiplets are just one option on the table. Chip scaling and other approaches besides remain in play. It’s likely that the industry will requisite more than one option.

    As before, it boils down to cost, performance and power. The industry is just birth to sort out the issues. It will select time before the dust settles.

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    SUSE [1 Certification Exam(s) ]
    Sybase [17 Certification Exam(s) ]
    Symantec [134 Certification Exam(s) ]
    Teacher-Certification [4 Certification Exam(s) ]
    The-Open-Group [8 Certification Exam(s) ]
    TIA [3 Certification Exam(s) ]
    Tibco [18 Certification Exam(s) ]
    Trainers [3 Certification Exam(s) ]
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    TruSecure [1 Certification Exam(s) ]
    USMLE [1 Certification Exam(s) ]
    VCE [6 Certification Exam(s) ]
    Veeam [2 Certification Exam(s) ]
    Veritas [33 Certification Exam(s) ]
    Vmware [58 Certification Exam(s) ]
    Wonderlic [2 Certification Exam(s) ]
    Worldatwork [2 Certification Exam(s) ]
    XML-Master [3 Certification Exam(s) ]
    Zend [6 Certification Exam(s) ]





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